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Description
Thermally Conductive Silicone Interface Pad Mat Sheets,Silicone Interface Heat Transfer Pad Mat Sheets,Silicone Interface Pad Mat Sheets Cooler,Silicone Interface Cooling Pad Mat Sheets
Technical Data:
Thermally Conductive Silicone Interface Pad: HWP-080
Product Features:
-Good thermal conductivity
-High conformability and cost effective
-Shock absorbing and naturally tacky
-Electrically insulating
-it is easy to fill in air gaps between PC board and heat sinks or a metal chassis
Product Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Product description:
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Typical Properties of HWP-080 Pad |
|||
|
Properties |
Units |
HWP080 |
Test Method |
|
Construction & Composition |
--- |
Silicone & Ceramic filled |
--- |
|
Color |
--- |
Gray |
Visual |
|
Thickness Range |
mm |
0.5~12.0 |
--- |
|
Hardness |
Shore C |
18 or 35 |
ASTM D2240 |
|
Density |
g/cc |
2 |
ASTM D792 |
|
Tensile Strength |
KN/m |
1.3 |
ASTM D412 |
|
Elongation |
% |
1.35 |
ASTM D412 |
|
Continuous Use Temp |
℃ |
-40 to 150 |
EN344 |
|
Breakdown Voltage |
Kv/mm |
≥4.0 |
ASTM D149 |
|
Volume Impedance |
ohm-cm |
1.7*1016 |
ASTM D257 |
|
Dielectric Constant |
1MHz |
4.51 |
ASTM D150 |
|
Weight Daminify |
--- |
≤1﹪ |
@150℃ 240H |
|
Flame Rating |
--- |
V0 |
UL 94 |
|
Thermal Conductivity |
W/m.k |
0.8 |
ASTM D5470 |
|
UL, RoHS, REACH |
--- |
Compliance |
--- |
