thermally conductive silicone gap filler HWP-180

Product Item：HWP-180

Thermally Conductive Silicone Interface Pad Mat Sheets

Silicone Interface Heat Transfer Pad Mat Sheets

Silicone Interface Cooling Pad Mat Sheets

Silicone Interface Pad Mat Sheets Cooler

Description

Thermally Conductive Silicone Interface Pad Mat Sheets,Silicone Interface Heat Transfer Pad Mat Sheets,Silicone Interface Pad Mat Sheets Cooler,Silicone Interface Cooling Pad Mat Sheets,Cooling Silicone Interface Pad,thermally conductive interface silicone pad,thermally conductive silicone gap filler HW180

Technical Data:

Product Features:

Thermal conductivity: 1.8W/m-K

Available in thickness from 0.020” – 0.200”
(0.5mm- 5.08mm),
0.010-inch (0.25mm)
increments

Naturally tacky for adhesion during assembly and transport

Product Applications:

Telecommunication hardware

Memory Modules

LED solid state lighting

Computer and peripherals

Automotive electronics

Mass storage devices

Small network equipment

Radios,audio, projecter and video component

Cooling components to chassis

Power electronics

Set top boxes

LCD and PDP flat panel TV

Configurations Available and Options

Sheet form (18”X18”,18”X9”) and die-cut parts

A1 indicates only one side tacky

Product description:

Typical Properties of HWP-180
Properties	Units	HWP180	Test Method
Construction & Composition	---	Silicone & Ceramic filled	---
Color	---	Light Violet	Visual
Thickness Range	mm	0.5~5.0mm	ASTM D374
Hardness	Shore 00	50	ASTM D2240
Density	g/cc	1.93	ASTM D792
Continuous Use Temp	℃	-60 to 160	EN344
Breakdown Voltage	Vac/mm	≥300	ASTM D149
Volume Impedance	ohm-cm	6*10¹⁶	ASTM D257
Dielectric Constant	1MHz	5.5	ASTM D150
Flame Rating	----	V-0	UL 94
Thermal Conductivity	W/m.k	1.8	ASTM D5470
UL, RoHS, REACH	----	Compliance	----